Feasibility of induction heating fused wire continuous deposition forming

材料科学 沉积(地质) 基质(水族馆) 融合 图层(电子) 复合材料 铝 极限抗拉强度 合金 感应加热 熔化温度 冶金 哲学 古生物学 工程类 地质学 电气工程 海洋学 生物 语言学 电磁线圈 沉积物
作者
Shichun Li,Min Ou,Caizhang Zhu,Junhui Liao,Junzhe Li,Quanhai Xiao,Haiyang Peng,Lei Zhou,Gang Xiao
出处
期刊:Journal of materials research and technology [Elsevier BV]
卷期号:26: 7137-7152
标识
DOI:10.1016/j.jmrt.2023.09.019
摘要

The experimental research was carried out to reveal the feasibility of induction heating fused wire continuous deposition forming of 7075 aluminum alloy. Single-channel, single-layer and multi-layer forming processes were investigated respectively. The influences of printing speed, filling height, substrate temperature and filling spacing on forming quality were studied, and the performance of the forming sample was tested and analyzed. The results show that in the single-channel forming experiment, the printing speed has the most significant effect on the melting width and melting height. With the increase of the printing speed, the melting height and melting width are reduced, and the reduction rate is gradually slow. The effect of filling height on melting height and melting width is not obvious. When the substrate temperature is 600 °C, the fusion performance between the forming melt and the substrate is the best. In the single-layer forming experiment, the filling spacing has obvious influence on the bonding effect between the melting channel, and the substrate temperature has great influence on the uniformity and overall quality of the melting channel. In the multi-layer forming experiment, the overlapping between the layers of the forming sample is dense, and the overall fusion performance of the sample is good. The overall hardness fluctuation range is about 65∼78HV, and its tensile strength reaches 184 MPa, which is about 57.3% of the tensile strength of the aluminum substrate. The research results of this paper demonstrate the feasibility of the additive manufacturing method of induction heating fused wire continuous deposition.
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