Prepreg-based FCBGA for Advanced Packaging Substrate

For Advanced Packaging (AP), it is essential to use Flip-chip Ball Grid Array(FCBGA), and Ajinomoto Build-up Film (ABF) is employed as the build-up material for implementing fine trace patterns. In cases where the size of the substrate needs to increase due to multifunctionality, there is a necessity to thicken the Center Core (CCL, Copper Clad Laminate) to minimize the risk of warpage, which causes limitations in board design and reduces electrical performance (SI/PI). In this paper, we focus on FCBGA utilizing Prepreg, aiming to demonstrate the effects not only on the advantages of SI/PI through a reduction in the thickness of the Center Core’s CCL but also on the mechanical aspects. This will be achieved through simulations, actual substrate fabrication, and evaluations.