Multiphysical design of compact RF modules on a silicon-ceramics substrate

In the upcoming "Beyond Moore" era of technology development, raw transistor scaling becomes less important to differentiate one design from another. Instead, the incorporation of multiphysics elements, like microelectro-mechanical systems (MEMS), is a key path to further increase the overall performance and functional density of a RF system. Within this work, a new heterogeneous integration concept, based on a silicon-ceramics composite substrate approach, is detailed that allows for a compact integration of MEMS devices together with microelectronic components. The substrate construction is described briefly, the integration of core elements like MEMS resonators and switches is depicted, and the inherent advantages of the concept are revealed. A LTE RF frontend as a technology demonstrator is presented which illustrates the developed concepts.