Dielectric performance enhancement of nanoparticle-based materials for embedded passive applications

Novel materials for embedded capacitor applications are in great demands, for which high dielectric constant (k), low dielectric loss and process compatibility with the printed circuit boards (PCBs) are the most important prerequisites. We have systematically investigated an efficient way to enhance the dielectric performance of the high-k nanocomposites by the selection of the appropriate filler, its size, size distribution, surface property and morphology (aggregation status).