材料科学
包层(金属加工)
硅
绝缘体上的硅
耦合损耗
光电子学
带宽(计算)
波长
光纤
硅片
光学
炸薯条
联轴节(管道)
电气工程
电信
物理
工程类
冶金
计算机科学
作者
Roberto Larrea,Ana Maria Gutierrez,Amadeu Griol,A. Brimont,Pablo Sanchis
标识
DOI:10.1109/lpt.2018.2881334
摘要
A fiber-to-chip spot size converter (SSC), fully compatible with silicon-on-insulator technology and optimized for efficient coupling in the O-band, is proposed, designed, and experimentally demonstrated. The SSC is based on a parabolic inverted taper structure in between two lateral air trenches. The proposed air trenches only require one extra etch step after the silica cladding deposition and allow improving the optical confinement and therefore minimize the coupling losses. An optical bandwidth of 60 nm across the O-band and coupling losses as low as 2 dB at the wavelength of 1310 nm have been experimentally demonstrated.
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