A simple way to prepare large-scale copper nanoparticles for conductive ink in printed electronics
作者
Yu Zhang,Pengli Zhu,Rong Sun,Ching‐Ping Wong
标识
DOI:10.1109/icept.2013.6756479
摘要
Well-dispersed stable copper based conductive ink was prepared in which the copper nanoparticles possess a more excellent dispersive, monodispersed size distribution and strong anti-oxidation. Conductive patterns were manufactured with the conductive ink via silk-screen printing onto the flexible substrate. The resistivity of the conductive films was 18.9 μΩ-cm after heat-treatment at 250 °C for 30 min under inert atmosphere.