A Design of Management of High-Power LED Module Heat Dissipation
作者
Yan Rong-tia
摘要
High-power LED module produces a lot of heat when lighting,which causes rise of LED junction temperature and very strong worse impact on the lifetime of LED module. The management of high-power LED module heat dissipation becomes research focus of the industry. This paper based on the study in the technology of encapsulation and heat pipe,puts forward a design of management of heat dissipation with combination of COB and heat pipe. The study shows that the design of management of heat dissipation can meet the requirement of high-power LED module heat dissipation with high efficiency of heat dissipation.