材料科学
钝化
光电子学
硅
接口(物质)
氧化物
冶金
纳米技术
电流密度
蚀刻(微加工)
作者
Lizhen Shui,Lina Ye,Hailong Zhang,Shengjie Guan,Zhenhai Yang,Huan Pu,Sheshicheng Chen,Haojiang Du,Hongkai Zhou,Na Lin,Mingdun Liao,Liu W,Zhiqin Ying,Xi Yang,Chuanxiao Xiao,Hisham Nasser,Eni Muka,Raşit Turan,Zunke Liu,Yuheng Zeng
出处
期刊:Small
[Wiley]
日期:2026-04-29
卷期号:: e73603-e73603
摘要
architecture effectively lowers interface defect density and enhances p-type TOPCon passivation, underscoring its significant potential for industrial application in high-efficiency TBC cells.
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