The Dynamics of Electromigration in Copper Nanocontacts

Electromigration (EM) arising in copper nanocontacts was directly observed by in situ transmission electron microscopy while simultaneously measuring the current passing through and force acting on them. Strain, stress, and current density during EM were analyzed. The analysis showed that the nanocontacts expanded owing to intensive electromigration, and the threshold current density for electromigration induction was estimated to be ∼70 TA/m 2 .