Thermal Simulation and Optimization Analysis for BGA

Thermal management of packaging is very important to the reliability and quality of electrical products. In this study, a simulation method is proposed to evaluate the thermal performance of BGA609P attached on printed circuit board(PCB). Flotherm Computational Fluid Dynamics(CFD)software is employed to predict the package thermal performance. The simulation results show that thermal conductivity of BT material, thermal conductivity of molding compound, structural change of via and substrate, produce some opening in solder-mask have significant impact on thermal resistance of BGA609P.