Twin‐jet electropolishing for damage‐free transmission electron microscopy specimen preparation of metallic microwires

Abstract A method to prepare TEM specimens from metallic microwires and based on conventional twin‐jet electropolishing is introduced. The wire is embedded in an opaque epoxy resin medium and the hardened resin is mechanically polished to reveal the wire on both sides. The resin containing wire is then cut into discs of the appropriate size. The obtained embedded wire is electropolished in a conventional twin‐jet electropolishing machine until electron transparency in large areas without radiation damage is achieved.