Moisture Absorption and Desorption Characterization for Plastic SiP Package

The purpose of plastic molding compound is to protect IC chip and build transportation for power and signal between all the electronic components inside IC. However, the plastic packages have a tendency to absorb moisture form surrounding. The moisture is known to be the one of a reason causing package crack and delamination during the reflow process.In order to avoid such phenomenon, the choice of package materials becomes an important factor. Several studies showed that the moisture qualification test recognized by JEDEC (J-STD-020) has a relationship between moisture weight gain and delamination or cracking in the packages. Using this test is a good way for MSDs on determining its floor life and baking time. This paper will provides an introduction on the purpose of moisture weight gain and weight loss test in terms of SiP (System-in-Package), illustrating with actual examples and highlight the moisture evaluation method is important to the future MSL test.