Heat Transfer Enhancement in Microchannels: Applications in Electronics Cooling

With the continuous miniaturization and integration of electronic components, thermal management has become a critical challenge. Microchannel heat sinks (MCHSs) offer a promising solution due to their compactness and high heat transfer efficiency. This paper explores recent advances in heat transfer enhancement techniques within microchannels, focusing on their application in electronics cooling. Various strategies including passive, active, and hybrid methods are examined, along with the role of nanofluids, surface structuring, and flow manipulation. The study also evaluates performance trade-offs in terms of thermal resistance, pressure drop, and manufacturing feasibility. The findings underscore the potential of microchannel-based cooling systems in maintaining optimal operating temperatures for high-performance electronics.