Research Progress of Phase Change Materials for Thermal Management in Electronic Components

Abstract With the rapid development of electronic equipment such as computers, mobile phones, cameras, power grids, cars and radars, the demand for electronic equipment is increasing. Moore's Law states that the quantity of transistors on a microchip continually grows. Electronic devices are becoming smaller and thinner. However, this leads to increasingly powerful electronic devices and higher peak temperatures, which shorten their service life and reducing performance. Phase Change Materials (PCM) provide benefits like a high latent heat of fusion, constant phase change temperature and fast phase change response speed, and has become a research focus to solve the problem of shortening service life. This paper primarily focuses on the heat storage mechanism of PCM, as well as its performance analysis and application in electronic components. To address the low thermal conductivity of PCMs, three approaches have been employed. Metal fins, adding nanomaterials, and adding porous metal foam.