聚酰亚胺
纳米孔
电介质
氢氟酸
材料科学
多孔性
复合材料
溶胶凝胶
透射电子显微镜
化学工程
极限抗拉强度
高分子化学
图层(电子)
纳米技术
光电子学
冶金
工程类
作者
Lizhong Jiang,Liu Jiugui,Dezhen Wu,Hangquan Li,Riguang Jin
标识
DOI:10.1016/j.tsf.2005.12.216
摘要
A method to generate nanoporous polyimide films with low dielectric constants was proposed. The preparation consisted of two steps. Firstly, a polyimide/silica hybrid film was prepared via sol–gel process. Secondly, the hybrid film was treated with hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between 20 and 120 nm, depending on the size of silica particles. Both hybrid and porous films were subjected to a variety of characterizations including transmission electron microscopy observation, dielectric constant measurement and tensile strength measurement.
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