Particle Adhesion and Removal in the Semiconductor Industry
作者
Ahmed Busnaina,Xiaorong Xiong,J. G. Park
标识
DOI:10.1115/2003-trib-0277
摘要
The Adhesion and removal of small particles to surfaces is very important to many industries such as semiconductor manufacturing, imaging, aerospace, etc. In most cases, particles represents undesirable contaminants that lower product yield and cause defects. These particulate contaminants may be generated by the process or the product environment. The industry sets threshold specification for acceptable contamination for each generation of products.