Influences of bonding process parameters on mechanical properties of the Micro-LED device

The influences of bonding process parameters on mechanical properties of Micro-LED light emitting device were investigated by finite element simulation, bonding experiment, and shear tests. The total deformation of the surface of the In bump after bonding process was analyzed by finite element method. Anand constitutive model was used to characterize the viscoplastic behavior of In bumps during the bonding process. All Micro-LED chips within the 30×8 Micro-LED light-emitting devices array are luminous. The average shear strength of the Micro-LED device increases significantly with bonding temperature, ranging from 6.04 MPa to 58.06 MPa. The average shear strength increases initially then decreases as bonding temperature and pressure are increased further. The peak shear strengths for the samples are achieved at the bonding pressure of 50 N and bonding time of 600 s, respectively.