聚丙烯
材料科学
复合材料
保温
热的
工程物理
纳米技术
热力学
物理
图层(电子)
作者
Chunxin Wang,Jun Xie,Qi Liu,Yaxuan Liu,Qing Xie
标识
DOI:10.1088/1402-4896/adb346
摘要
Abstract According to the problems of poor insulation and local temperature rise of polypropylene film, a new nano-filler was studied, and the mechanism of improving insulation and thermal conductivity was analyzed. TiO2 with high dielectric constant is combined with Al2O3 with excellent thermal conductivity in the form of a core-shell structure. TiO2increases the dielectric constant of polypropylene films, and shell Al2O3introduces high thermal conductivity and assumes the role of dielectric buffer layer. Compared with pure PP, the breakdown voltage of PP/TiO2 is increased by 6.05%, the thermal diffusivity coefficient is increased by 110.67%, the breakdown voltage of PP/TiO2@Al2O3 is increased by 37.05%, and the thermal diffusivity coefficient is increased by 266.85%. Experimental and simulation results show that TiO2introduces low-density traps, TiO2@Al2O3introduces high-density deep traps, and Al2O3modifies the surface defects of high-dielectric nanoparticles and increases the equivalent interface region. Based on the analysis of the experimental results with different mass fractions, this paper proposes the optimal filling ratio of the new core-shell, which provides a new method for the composite dielectric to improve the insulation and thermal conductivity at the same time.
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