材料科学
堆栈(抽象数据类型)
激光器
二极管
焊接
巴(单位)
光电子学
占空比
结温
可靠性(半导体)
压力(语言学)
电压
功率(物理)
复合材料
电气工程
光学
计算机科学
工程类
物理
哲学
气象学
量子力学
程序设计语言
语言学
作者
Tobias Barnowski,Thilo Vethake,Katie Atwater,Timothy J. Gong,Reza Shoja Razavi,Eric Zanghi,Ping Zhang,S.D. McDougall
摘要
We report a novel approach for the assembly of monolithic diode laser stacks with up to 56 laser diode bars at 0.48mm pitch. These stacks are based on 940nm laser bars AuSn soldered on CuW-submounts. By joining the 56 bar-on-submounts (BoS) using an electrically conductive material the complete continuous stack is formed. A robot is used to load these BoS into fixtures for the bonding process. We show the attachment of this monolithic stack to an insulated micro-channel cooler using electrically insulating bonding material to complete the laser module. Use of the novel bonding materials at lower joining temperatures, compared to conventional soldering processes, results in a stack assembly with lower induced stress which allows monolithic stacks with higher number of elements. We demonstrate peak power above 500W per bar at 0.3% duty cycle and 500A peak current with an average junction temperature of 45°C, with over 29kW total peak power. Analysis of the dynamic temperature behavior within the pulses is presented using fast spectral measurements and simulation along with initial reliability test results.
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