Design and Research of Oval Flip Chip Solder Bump

With the actual demand of the market, the miniaturized high density packaging of components is becoming more and more common. System ln a package enables higher density and more functional integration in limited space. Flip chip is a new surface mounting technology for microelectronics manufacturing. In terms of packaging substrate design, the traditional circular FC Bump substrate design has many layers of substrate and high cost. In this paper, a new oval FC solder bump is introduced to reduce the number of layers required in the substrate design, reduce the cost and improve the production efficiency of the FC substrate.