材料科学
图层(电子)
干法蚀刻
蚀刻(微加工)
湿法清洗
氧化物
等离子体刻蚀
腐蚀坑密度
等离子体
干洗
光电子学
复合材料
冶金
化学工程
化学
废物管理
物理
有机化学
量子力学
工程类
作者
Tomoki Hirano,Suguru Saito,Yoshiya Hagimoto,Hayato Iwamoto
摘要
In this study, we investigated the effect of the post-etch cleaning of GaAs surfaces. We found that a plasma damage layer was formed on GaAs surfaces by dry etching, and an As-rich layer remained after post-etch cleaning. The As rich layer needs to be removed because it is replaced by micron-sized particles when stored in an air. We also found that a pure GaAs surface can be obtained by performing additional cleaning consisting of oxide formation and removal.
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