散热片
电子设备和系统的热管理
热的
水槽(地理)
计算机科学
材料科学
机械工程
工程类
热力学
物理
地图学
地理
作者
Laxmikant Mangate,Siddhant Ghuge,Abhishek Khairnar,Suraj Dixit,Akshay Kale,Gayatri Hujare,Sanveda Gholap,Gagnesh S. Sawant
标识
DOI:10.1109/iraset64571.2025.11008080
摘要
A heat sink functions as a passive cooling system, extracting heat from an electronic or mechanical device and transferring it to a fluid medium like air or liquid coolant. This process enables the regulation of the device's temperature to prevent overheating. The paper provides an overview of the current state of research on heat sink designs for processor cooling in laptops. The review discusses various materials for heat sink designs and their effectiveness in dissipating heat from electronic devices. There is a comparison between various materials other than aluminum and copper. Through that comparison, the paper determines the best alternative materials for aluminum and copper in a heat sink.
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