倍半硅氧烷
苯并环丁烯
电介质
纳米复合材料
共价键
高分子化学
材料科学
化学工程
聚合物
化学
高分子科学
纳米技术
复合材料
有机化学
光电子学
工程类
作者
Meng Xie,Yan He,Rui Xue,Wenjie Fan,Menglu Li,Quan Sun,Jennifer Qing Lu,Zongbo Zhang,Wenxin Fu
出处
期刊:Macromolecules
[American Chemical Society]
日期:2025-08-04
卷期号:58 (15): 8419-8430
被引量:4
标识
DOI:10.1021/acs.macromol.5c01532
摘要
Next-generation, high-frequency communication systems demand polymer nanocomposites with simultaneously ultralow dielectric constant ( D k < 2.0) and high thermomechanical stability while addressing the critical challenge of reconciling nanoscale dispersion uniformity with interfacial compatibility. Herein, we propose a molecular engineering strategy to covalently anchor oligomeric silsesquioxane domains within a benzocyclobutene resin (BCB) matrix via synergistic click chemistry and thermally triggered Diels–Alder cross-linking. The silsesquioxane precursors are precisely synthesized through platinum-catalyzed hydrosilylation and hydrolysis-polycondensation, enabling the formation of ladder/cage-like and networked Si–O–Si structures. This covalent integration strategy ensures uniform silsesquioxane dispersion at the subnanoscale, as evidenced by small-angle X-ray scattering (SAXS) and high-resolution transmission electron microscopy (TEM). The optimized nanocomposite exhibits an ultralow dielectric constant ( D k = 1.78) and loss ( D f = 2.73 × 10 –3 ) at 1.15 kHz, outperforming most reported BCB hybrids. This work establishes a molecular-scale engineering paradigm for low- D k materials, offering transformative potential in 5 G /6G communications and high-density integrated circuit technologies.
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