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Politeness in Business Communication: Investigating English Modal Sequences in Chinese Learners’ Letter Writing

礼貌 语言学 背景(考古学) 语用学 情态动词 商务英语 跨文化交际 心理学 商务沟通 多样性(控制论) 计算机科学 教育学 历史 人工智能 沟通 高分子化学 哲学 化学 考古
作者
David D. Qian,Mingwei Pan
出处
期刊:RELC Journal [SAGE Publishing]
卷期号:50 (1): 20-36 被引量:21
标识
DOI:10.1177/0033688217730142
摘要

Politeness has been a source of inspiration for research in pragmatics and inter- and intra-cultural communication. However, the existing literature focusses more on how politeness is realized in the context of first language use. Few studies have investigated the issue related to the use of English by second language learners from varying subcultures within the same cultural tradition. The present study examines how Hong Kong and Shanghai tertiary-level learners of English convey politeness in their business letter writing, as reflected in the use of modal sequences. Three hundred business letters were collected from students in Hong Kong and another 300 from students in Shanghai. Majoring in various disciplines, these students were all in their final year of study, and their English proficiency level was generally scored at B2, as compared with the Common European Framework of Reference for Languages. Following a mixed-methods approach, the study tracked a rather complex distribution of politeness realizations by different modal sequences. The findings were that Hong Kong ESL learners appeared to be more strategic users of modal sequences as evidenced by a variety of usage examples from the two purpose-built learner corpora, which were developed to monitor and compare English learners’ business writing at the tertiary level. Another finding was that epistemic modality tended to better preserve politeness in the writing.
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