机械加工
单晶硅
钻石
材料科学
抛光
表面粗糙度
激光器
光学
垂直的
表面光洁度
光电子学
复合材料
冶金
硅
几何学
物理
数学
作者
Yasuhiro Okamoto,Akira Okada,Atsushi Kajitani,Togo Shinonaga
出处
期刊:CIRP Annals
[Elsevier]
日期:2019-01-01
卷期号:68 (1): 197-200
被引量:12
标识
DOI:10.1016/j.cirp.2019.04.119
摘要
In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than Ra = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.
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