电容器
小型化
制作
电容
材料科学
介电常数
纳米技术
数码产品
薄膜
工程物理
可扩展性
电气工程
电介质
光电子学
计算机科学
工程类
物理
电压
电极
数据库
医学
病理
量子力学
替代医学
作者
Geoff L. Brennecka,Jon Ihlefeld,Jon‐Paul Maria,Bruce A. Tuttle,Paul G. Clem
标识
DOI:10.1111/j.1551-2916.2010.04211.x
摘要
Capacitor technologies are as varied as the applications that they enable, but one of the common themes in advanced capacitors for consumer electronics is a desire for increased capacitance in smaller areas/volumes. The heroic advances of discrete capacitor manufacturers have kept pace with the increasing demands of miniaturization, but a time is quickly approaching when it appears that powder‐based fabrication techniques simply will not be able to achieve desired layer thicknesses and capacitance densities. Here, we review the current state of the art and recent advances in the processing science and technology of high‐permittivity thin films with a focus on industrially scalable solution‐based fabrication processes of perovskite ferroelectric systems that appear to offer the greatest promise for the fabrication of future nanoscale capacitors.
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