Thermal and Electrical behaviors of Boron Nitride/Epoxy reinforced polymer matrix composite—A review

材料科学 复合材料 环氧树脂 氮化硼 热导率 导电体 复合数 聚合物
作者
Dinesh Ramesh Salunke,G. Venkatachalam
出处
期刊:Polymer Composites [Wiley]
卷期号:42 (4): 1659-1669 被引量:46
标识
DOI:10.1002/pc.25952
摘要

Abstract In electronic and electric instruments, heat dissipation is one of the major issues that degrade performance and efficiency. Polymer material has high specific strength and modulus, and it is mainly used in electrical insulation materials due to easy processability and light in weight with great flexibility but has low thermal conductivity. This paper examines the recent developments in highly thermal conductive epoxy‐based polymer composites. First, the composite materials, with applications, are briefly introduced. Second, the thermally conductive polymer types with their thermal conductivity are summarized. Third, the thermal and electric properties of different boron nitride (BN) with epoxy‐filled composite are listed. It also focuses on enhancement in thermal conductivity and electrical insulation, which are mainly influenced by the microstructure and amount of filler content. Some highly thermal conductive BN polymer based composites are reviewed. Fourth, various thermal conductivity measurement techniques are listed with their drawbacks. Finally, the review gives current scenario on thermal conductive polymer materials and developments needed with challenges in this area.
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