Transparent Electrodes Based on Crack-Templated Metallic Networks for Next-Generation Optoelectronics

Transparent conductive electrodes (TCEs) are essential components in modern optoelectronic devices, including organic light-emitting diodes and solar cells, sensors, and flexible displays. Indium tin oxide has been the dominant material for TCEs due to its high transparency and conductivity. However, its brittleness, high cost, and increasingly limited availability pose significant challenges for electronics. Crack-template (CT)-assisted fabrication has emerged as a promising technique to develop metal mesh-based TCEs with superior mechanical flexibility, high conductivity, and excellent optical transmittance. This technique leverages the spontaneous formation of random and continuous microcrack networks in sacrificial templates, followed by metal deposition (e.g., Cu, Ag, Al, etc.), to produce highly conductive, scalable, and low-cost electrodes. Various crack formation strategies, including controlled drying of polymer suspensions, mechanical strain engineering, and thermal processing, have been explored to tailor electrode properties. Recent studies have demonstrated that crack-templated TCEs can achieve transmittance values exceeding 85% and sheet resistances below 10 Ω/sq, with mesh line widths as low as ~40 nm. Moreover, these electrodes exhibit enhanced stretchability and robustness under mechanical deformation, outperforming ITO in bend and fatigue tests. This review aims to explore recent advancements in CT engineering, highlighting key fabrication methods, performance metrics across different metals and substrates, and presenting examples of its applications in optoelectronic devices. Additionally, it will examine current challenges and future prospects for the widespread adoption of this emerging technology.