异质结
范德瓦尔斯力
薄脆饼
外延
材料科学
金属
比例(比率)
原子单位
凝聚态物理
光电子学
纳米技术
化学
物理
冶金
量子力学
分子
有机化学
图层(电子)
作者
Shenghong Liu,Ke Qin,Jiashu Yang,Tao Hu,Hao Luo,Jingsong Wu,Zhen Cui,Taotao Li,Feng Ding,Xinran Wang,Yuan Li,Tianyou Zhai
摘要
Two-dimensional (2D) van der Waals (vdW) heterostructures have emerged as a groundbreaking candidate for future integrated circuits due to their tunable band structures, atomically sharp interfaces and seamless compatibility with complementary metal-oxide-semiconductor technologies. Despite their promise, existing synthesis methods, such as mechanical transfer and vapor-phase conversion, struggle to achieve the high-quality, scalable production for practical applications. In response to these longstanding challenges, our study unveils for the first time the direct epitaxial growth of wafer-scale 2D vdW heterostructures (MoS[Formula: see text]/SnS[Formula: see text]) with exceptional quality and uniformity. This achievement is made possible through fundamentally enhancing the adsorption interactions between intermediates and the underlying material. The heterostructures display pristine, defect-free interfaces, consistent crystal orientation and wafer-level thickness uniformity. The Raman peak shifts of MoS[Formula: see text] and SnS[Formula: see text] are constrained to below 0.5 cm[Formula: see text] across the entire wafer, with intensity deviations maintained within an impressive 2%, and thickness uniformity surpassing 99.5%. Owing to their exceptional crystallinity and interface quality, the heterostructures demonstrate extraordinary electron and hole transfer capabilities, showcasing a prominent rectification effect and an astounding responsivity of [Formula: see text] A/W, averaged from 30 devices. Our study signifies a pivotal advancement for the integration of 2D materials into semiconductor technologies, paving the way for next-generation integrated circuits.
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