Research on Properties of Silicone-Modified Epoxy Resin and 3D Printing Materials

A kind of organosilicon intermediate was prepared using isophorone diisocyanate (IPDI), hydroxyl silicone oil (HSO), and hydroxyethyl acrylate (HEA). The organosilicon modification of epoxy resin was realized by introducing a −Si–O– group into the side chain of epoxy resin by chemical grafting. The effects of organosilicon modification of epoxy resin on the mechanical properties systematically discuss its heat resistance and micromorphology. The results indicate that the curing shrinkage of the resin was decreased and the printing accuracy was improved. At the same time, the mechanical properties of the material are enhanced; the IS and elongation at break (EAB) are enhanced by 32.8 and 8.65%, respectively. The brittle fracture is changed to a ductile fracture, and the tensile strength (TS) of the material is decreased. The glass transition temperature (GTT) of the modified epoxy resin increased by 8.46 °C, and T50% and Tmax increased by 1.9 and 6 °C, respectively, indicating that the heat resistance of the modified epoxy resin was improved.