Fabrication of Cu/Al compound materials by solid-liquid bonding method and interface bonding mechanism

Cu/Al compound materials were fabricated by solid-liquid bonding method, and then the microstructures and bonding properties of Cu/Al interfaces were studied. According to the analysis of the effects of the processing parameters on Cu/Al interfaces, the bonding process was optimized. The results show that the well-bonded interface with a transition layer of about 45 μm in thickness and a shear strength of 57 MPa can be obtained as the Cu plate pre-treated in a mix solution is preheated at 400 ℃ and the pouring temperature is 700 ℃. From further study, it is indicated that the bonding of the Cu/Al interface is carried out by the melting of copper and its diffusion in aluminum.