材料科学
无定形固体
猝灭(荧光)
非晶态金属
铜
基质(水族馆)
物理气相沉积
沃罗诺图
沉积(地质)
图层(电子)
分子动力学
金属
化学工程
复合材料
薄膜
冶金
化学物理
纳米技术
结晶学
光学
合金
生物
化学
数学
工程类
地质学
物理
沉积物
几何学
计算化学
古生物学
海洋学
荧光
标识
DOI:10.1016/j.mtcomm.2021.102083
摘要
Abstract In this work, the simulation of the physical vapor deposition process of Cu on amorphous silica substrate was performed. The resultant Cu thin layer is amorphous. In addition, the liquid quenching of Cu from 2000 K to 50 K was simulated with different cooling rates to allow the comparison of Cu metallic glass formation. Copper glasses from the two different processes (PVD and quenching) showed comparable radial distribution functions. However, the Voronoi tessellation analyses revealed different local structures. The Cu glass obtained by PVD process exhibited higher densities and lower potential energies when compared to its melt-quenched counterpart, which resembles the properties of ultrastable glasses.
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