3D Electronic Photonic Integrated Circuits (3D EPICs): Co-Design and Co-Integration for Optimal Performance at Scale
作者
Yi‐Chun Ling,S. G. Lee,Ahmed Mortuza Saleque,Yichi Zhang,S. J. Ben Yoo
出处
期刊：Conference on Lasers and Electro-Optics日期：2024-01-01卷期号：: JTh3K.1-JTh3K.1被引量：1
标识
DOI：10.1364/cleo_at.2024.jth3k.1
摘要
We discuss the impact of the 3D photonic integrated circuits (PICs), review enabling technologies including optical through-silicon-vias, and cover co-integration and co-design of 3D Electronic-Photonic-Integrated-Circuits (3D EPICs).
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(2025-6-4)
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