Novel IR Laser Release Temporary Bonding Solution for Advanced 3D Stacking and Layer Transfer

A novel temporary bonding technology has been developed based on using Si carrier wafers and ultrathin, inorganic IR laser release layers. In comparison to UV laser debonding, the full process flow including the employed materials had to be reconsidered by focusing on the simplicity and a reduced environmental impact. Newly developed LayerRelease™ technology facilitates high-density 2.5 and 3D integration [1], [2], even on nanometer- scale thin layers by providing fusion bondable carrier wafers.