材料科学
肖特基势垒
肖特基二极管
二极管
光电子学
击穿电压
功勋
带隙
金属半导体结
GSM演进的增强数据速率
电压
凝聚态物理
电气工程
计算机科学
电信
物理
工程类
作者
Sooyeoun Oh,Gwangseok Yang,Jihyun Kim
摘要
Vertical geometry β-Ga 2 O 3 Schottky barrier diodes (SBDs) were fabricated and the rectifying forward and reverse current-voltage characteristics were demonstrated at elevated temperatures for a freestanding β-Ga 2 O 3 material with an ultra-wide bandgap of ∼4.9 eV. The breakdown voltage of the fabricated β-Ga 2 O 3 SBDs with a punch-through configuration was ∼210 V without the edge-termination method. The electrical field and potential distributions were numerically simulated with a finite element method. The on-resistance was 2582 Ω·cm 2 at 25°C, and decreased to 0.043 Ω·cm 2 at 225°C. The figure-of-merit ( V BR 2 / R on ) was approximately 17.1 W·cm −2 . The temperature-dependent Schottky barrier height and ideality factor were also determined. The developed β-Ga 2 O 3 SBDs with the punch-through structure exhibit great potential for high power and high temperature applications.
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