Adhesive wafer bonding of GaAs/Glass with Benzocyclobutene and dry film for GaAs CCD

This paper studies adhesive wafer bonding of 4 inches GaAs CCD device wafer with Optik glass for wafer level packaging. In this work, Benzocyclobutene (BCB) and dry film (DF) were proposed as the bonding material. Efforts were devoted to the warpage control. The relationship between the extent of warpage and bonding parameters, such as the bonding profile, the thickness of bonding material, supporting wafer, were studied. The total bonding area and bonding strength were also studied. Under the optimized bonding conditions, warpage of 90.40 um was obtained for BCB bonding. The optimized condition was demonstrated. Nearly 100% bonding area was obtained for BCB bonding. For DF bonding, the warpage was 123.47. The bonding strength was 15.89 MPa for DF bonding.