Characterization of Siliconized Diallyl Bisphenol A Type Epoxy Resin and Study on Its Curing Properties

The structure of 3,3'-di(3-trimethoxysilicon propyl) bisphenol-A type epoxy resin(SEP) was characterized by FT-IR and ~(29)Si NMR and the properties including curing behavior of SEP were also studied.SEP was a novel silanized epoxy resin,which was of higher viscosity than normal bisphenol-A epoxy resin(E-51) at room temperature and similar viscosity over 60 ℃.The moisture-activated curing properties and epoxy group-activated curing properties were studied by means of the gelling time,DSC and FT-IR.The results showed that the moisture curing behavior of SEP was contributed to the condensation reaction of methoxylsilyl group in molecular at the moisture conditions and the tack-free time decreased with the increase of temperature.SEP could also cure with amino curing agent just like E-51,but the gelling time was longer than E-51 at room temperature and similar over 90℃.