材料科学
胶粘剂
导电体
环氧树脂
互连
复合材料
导电聚合物
灵活性(工程)
基质(水族馆)
导电的
聚合物
计算机科学
地质学
海洋学
统计
图层(电子)
数学
计算机网络
作者
Ruchi Aradhana,Smita Mohanty,SANJAY KUMAR NAYAK
标识
DOI:10.1016/j.ijadhadh.2020.102596
摘要
Electrically conductive adhesives (ECAs) are widely utilized in various electronic packaging applications including die fitting, solderless interconnections, component renovation, display interconnections, and heat dissipation, etc. ECAs seize attention of scientific researchers as green and sustainable lead-free interconnection material over conventional solders owing to their eco-friendliness, processing capability at low temperature, fewer processing steps, negligible stress on a substrate, flexibility and stretchability, and cost-effectiveness. Various researchers worked in the area of epoxy based conductive adhesives mainly focusing on the categories, conduction mechanisms, applications of conductive adhesives along with various types of conductive fillers, inherent conductive polymers and future prospective of epoxy resin in the field of conductive adhesives is presented.
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