Numerical Simulation for Electronic Package Warpage due to Geometrical Dimension

Electronic package plays an important role in integrate circuit. The reliability and the solderability of electronic package are significantly affected by the warpage resulted from the mismatch of material properties, such as Young's modulus, Poisson's ratio and coefficient of thermal expansion and the geometrical structure of each component for electronic package. The effectiveness of Glass Transition Temperature on material properties was considered. The numerical analysis results are applicable to the practical design of reliable electronic package.