Potential of Power Scaling for Laser Depaneling and its Influence on Temperature Behavior of the FR4 Substrate

ABSTRACT Laser material processing, especially laser depaneling, has been characterized by a continuous improvement in laser power in recent years and is expected to continue to do so in the future. In principle, an increase in power and the associated potential rise in performance opens up new areas of application. But how does this power scaling affect the quality and performance of the cutting process as well as the temperature behavior of the material? Therefore, this paper analyzes the general laser power and performance increase as well as its influence on the cutting edge quality and temperature behavior of the PCB substrate, specifically FR4. In this context, a same sample layout was processed for different laser power classes. In addition, measurements of the temperature behavior are compared and examined for potential correlations and trends. The influence of extended deflection technologies will be investigated using the example of the Tensor Technology - particularly with regard to the potential for further performance scaling in the future. The aim of the paper is to provide a well-founded statement on performance development and its possible influences as well as an outlook on further development and limitations.