A Dual Encapsulation Strategy for High‐Temperature Micro PCM Particles with High Cyclic Durability

Abstract Addressing critical issues such as high‐temperature corrosion, leakage, degradation, and subpar cyclic performance is imperative for phase change materials (PCMs), prompting the development of appropriate encapsulation techniques to surmount these challenges. In this study, a dual encapsulation strategy is proposed for high‐temperature micro PCM particles. Al–Si core is microencapsulated via the “solvent evaporation‐heating curing” method. Subsequently, TiO 2 is employed as the skeleton material for form‐stable encapsulation of PCM microcapsules by “cold pressed sintering”. Detailed analysis of the crystalline phase transformation mechanism in the sintering synthesis pathway of TiO 2 underscore its potential as a robust structural material with exceptional thermal stability. Furthermore, the incorporation of hexagonal boron nitride (hBN) results in a substantial enhancement of the thermal conductivity of the composites, increasing by 121.1–131.3%. The prepared form‐stable phase change microcapsules (FSPCMs) are subjected to 5000 thermal cycles in the air atmosphere. There is no observed PCM leakage or composite ruptures in the FSPCM. Moreover, the oxidized mass gain is merely 3.3%, signifying exceptional oxidation resistance. Thermophysical analysis indicates that FSPCM can retain 91.3% of the enthalpy after 2000 cycles, with over 80% preservation after 5000 cycles, underscoring its remarkable cyclic thermal durability.