Design and simulation analysis of a composite cooling structure combining solid-liquid phase change material and liquid cooling for IGBTs

Abstract In response to the temperature fluctuations during the operation of IGBT, a composite cooling structure that integrates solid-liquid phase change materials (PCM) and liquid cooling technology has been designed and simulated. A numerical simulation model of the heat source - heat sink-liquid cooling plate has been established. The results indicate that the double-sided composite cooling structure of the heat sink and liquid cooling can effectively reduce the maximum temperature of the IGBT by more than 2°C, and under a power density of 497 MW/m 3 , the phase change alloy heat sink delays the time for the IGBT to reach the danger temperature by 18.3 seconds, resulting in a 210% increase in the effective temperature control duration.