Research Progress on Silicone Resin for LED Encapsulation

Advances in LED packaging materials for silicone- modified epoxy resins and silicone- based materials were reviewed,described the physical blend of the silicone- modified epoxy resin and the chemical copolymerization process,and the use of silicone resins for LED package characteristics and advantages of the material,manufacturing process characteristics of silicone resin product and the current situation and prospect of possible future research directions silicone encapsulating material.