德拉姆
进程窗口
过程(计算)
窗口(计算)
制作
计算机科学
电容器
薄脆饼
规格#
材料科学
计算机硬件
纳米技术
工程类
电气工程
电压
操作系统
医学
替代医学
病理
程序设计语言
作者
Qingpeng Wang,Yu De Chen,Jacky Huang,Benjamin G. Vincent,Joseph Ervin
标识
DOI:10.1109/cstic55103.2022.9856740
摘要
Virtual fabrication was used for process window evaluation and optimization during pathfinding in an advanced DRAM capacitor process. Our results show that the in-spec ratio for an SADP approach will be 10% higher than that of using SAQP under optimized conditions and tightened specifications. The best capacitor area pass-rate (in-spec ratio) using an SADP approach can be enhanced to nearly 100%, while it only reaches 91% for the SAQP process. This research offers a quantified process window comparison for different patterning approaches. Using this approach, the optimal process target combinations and the largest process window can be achieved, prior to performing any wafer-based experimentation.
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