材料科学
等离子体
抛光
机械加工
分析化学(期刊)
等离子清洗
拉曼光谱
表面粗糙度
基质(水族馆)
光谱学
大气压等离子体
感应耦合等离子体
射频功率传输
复合材料
光学
冶金
光电子学
海洋学
量子力学
物理
地质学
化学
CMOS芯片
放大器
色谱法
作者
Hari Narayan Singh Yadav,Enni Krishna,Sreelakshmy Kombath,Dharm Dev,Manas Das
标识
DOI:10.1080/10426914.2023.2176873
摘要
Fused silica glass, in particular, offers a broad range of applications in optics. The present study investigates fused silica samples using non-conventional medium-pressure plasma polishing at optimum machining parameters. The polishing parameters, i.e. gas composition (He: (SF6+O2)) of 90:10, pressure ratio (SF6:O2) of 1:1, total pressure of plasma chamber of 5 mbar, and radio-frequency (RF) power of 80 W have been obtained at optimum parametric conditions. The highest material removal rate of 100.36 × 10−3 mm3/min is achieved at optimized process conditions. Even though the surface finish is slightly degraded from 0.28 µm to 0.30 µm, without any surface contamination as analyzed by the 3D optical profiler and Energy-Dispersive X-ray (EDX). Moreover, EDX analysis reveals the presence of fluorine elements after plasma processing, confirming the plasma's interaction with the substrate. Furthermore, Raman spectroscopy results show a maximum 13% reduction in damaged and strained layers after plasma processing on the machined surface..
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