Finite Element Analysis of Interfacial Delamination in Double Side Molding Power Module SiP During Reflow

The development of double-sided molding and component on package (CoP) technology can better meet the miniaturization of power module SiP, but due to the mismatch of thermal expansion coefficients (CTE) of different materials, interfacial thermal stress is generated, among which the largest thermal stress generally occurs at the interface between die and die attach adhesive. Excessive thermal stress can lead to delamination and affect the reliability of packaging. This paper uses virtual crack closure technique (VCCT) to explore the effects of crack length and curvature on the tip strain energy release rate (SERR) at reflow peak temperature (240°C) and room temperature (25°C). The results show that at 25°C, it is mainly driven by mode I and II component, as the delamination area increases, the Type I component decreases, but the Type II component initially increases and then decreases once a certain crack length is reached. At 25°C, it is mainly driven by type II component, and the larger the delamination area, the smaller the SERR. Place abstract here: usually a single paragraph summarizing the problem, approach, and results that are in the paper.