铜
铝
X射线光电子能谱
腐蚀
电化学
傅里叶变换红外光谱
缓蚀剂
化学
核化学
材料科学
润湿
无机化学
化学工程
有机化学
物理化学
电极
复合材料
工程类
作者
Dževad K. Kozlica,Anton Kokalj,Ingrid Milošev
标识
DOI:10.1016/j.corsci.2020.109082
摘要
Abstract Inhibitory action of 2-mercaptobenzimidazole (MBI) and octylphosphonic acid (OPA) and their binary combinations on copper and aluminium in 3 wt.% NaCl was investigated by electrochemical methods, whereas the bonding of inhibitors was scrutinized by XPS and FTIR spectroscopies, wettability measurements, and DFT calculations. MBI is a good inhibitor for Cu but not for Al, whereas OPA behaves complementary. Although OPA is not an inhibitor for Cu, it can synergistically boost corrosion inhibition of copper when added to MBI. Evidence suggests that OPA changes the bonding of MBI by making the copper surface more susceptible to MBI resulting in a thicker and more protective organic film.
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