材料科学
反射损耗
复合材料
热液循环
复合数
抗弯强度
氮化硼
热解
硼
涂层
化学工程
吸收(声学)
化学
工程类
有机化学
作者
Lingyu Yang,Lianhua Yin,Changqing Hong,Shun Dong,Chen Liu,Xinghong Zhang
标识
DOI:10.1016/j.jcis.2020.08.030
摘要
Excellent electromagnetic wave (EMW) absorbing materials with high-temperature stable and superior mechanical properties are among the most promising candidates for practical application. Here, novel hydrothermal carbon coated three-dimensional (3D) needled carbon fiber reinforced silicon-boron carbonitride (HC-CF/SiBCN) composites with a hierarchical A (CF)/B (HC)/C (SiBCN) structure were constructed and prepared for the first time by combining hydrothermal transformation and precursor infiltration and pyrolysis (PIP) process. The thickness of the HC coating controlled by the glucose concentration played a crucial role in tailoring the EMW capacity of the composite. The incorporation of SiBCN could not only effectively improve the oxidation resistance but also actively enhance the mechanical properties of the HC coated CF structure. Compared to the weak high-temperature oxidation resistance and mechanical properties of pristine 3D needled CF felt, the composites after the introduction of HC and SiBCN were thermostable in air atmosphere beyond 1000 °C to about above 70% weight retention, and the maximum flexural and compression strength of the composites could reach to 23.51 ± 1.37 and 12.22 ± 1.12 MPa, respectively. A substantial enhancement of EMW absorption ability was achieved through incorporation of HC and SiBCN, which could be attributed to the matched characteristic impedance and enhanced loss ability, whose optimization EMW absorption performance was the minimum reflection loss (RLmin) of −52.08 dB and effective absorption bandwidth (EAB) of 7.64 GHz for the composite obtained by two PIP cycles with 24 wt% glucose solution, demonstrating that the HC-CF/SiBCN composites with high-temperature stable, excellent mechanical and superior EMW absorption properties could be considered as a promising candidate for the applications in harsh environments.
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