高频SS
材料科学
网络分析仪(电气)
基质(水族馆)
微波食品加热
电感器
陶瓷
电感
频谱分析仪
螺旋(铁路)
电子工程
计算机科学
光电子学
机械工程
工程类
电气工程
复合材料
海洋学
电压
电信
地质学
微带天线
天线(收音机)
作者
Woon Choi,Shintaro Ono,S. Yoshida,Hajime Tomokage
标识
DOI:10.1115/ipack2005-73469
摘要
In order to obtain full information on the high frequency performance of embedded passive elements, we design test elements group (TEG) substrates and compare the simulation result with measured data. S-parameters of spiral inductors embedded in low temperature co-fired ceramic (LTCC) substrates are simulated using high frequency structure simulator (HFSS), microwave studio (MWS) and advanced design simulator (ADS). Then effective inductance and Q factors are calculated from S-parameters after de-embedding process. Measurements of S-parameters are performed using a vector network analyzer in the frequency range up to 15 GHz. The simulation result with dimensional data measured by laser microscope and X-lay microscope is in good agreement with the experimental result. It is suggested that the simulation results can be applied to the design of system-in-a-package (SiP) substrate directly without making TEG.
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