移相模块
放大器
芯片组
相控阵
电气工程
比克莫斯
发射机
计算机科学
电子工程
工程类
拓扑(电路)
晶体管
天线(收音机)
插入损耗
CMOS芯片
频道(广播)
炸薯条
电压
作者
Huanbo Li,Jixin Chen,Debin Hou,Zekun Li,Rui Zhou,Zhe Chen,Pinpin Yan,Wei Hong
出处
期刊:IEEE Journal of Solid-state Circuits
[Institute of Electrical and Electronics Engineers]
日期:2022-07-15
卷期号:57 (9): 2685-2701
被引量:21
标识
DOI:10.1109/jssc.2022.3188917
摘要
This article presents a pair of W-band phased-array transmitter (TX) and receiver (RX) chipsets in a 0.13- $\mu \text{m}$ SiGe BiCMOS process for high data-rate wireless communication. Both the chips integrate four compact front-end channels in 2 $\times $ 2 distribution, and the distance between the adjacent RF pads is less than 1.8 mm ( $0.56\lambda $ at 90 GHz) to fit for the tight antenna array and enable array scaling by tiling multiple unit cells. A 6-bit active phase shifter based on the improved phase-inverting variable gain amplifiers is leveraged to achieve high phase-shift precision and bandwidth concurrently. A noise reduction technique using a parallel inductor to resonate with the parasitic capacitors of the cascode transistors is adopted in the low-noise amplifier design. A novel miniature power combiner, which occupies a much more compact area than the Wilkinson power combiner while delivering great RF performance, is proposed and elaborately analyzed. System-level calibration for local oscillator (LO) leakage and dc-offset suppression is enabled by introducing digitally controlled current sources into the up-conversion and down-conversion mixers. On-wafer measurements for the TX chip exhibit a single-channel IF-to-RF conversion gain (CG) of 26 dB, a competitively high output 1-dB compression point (OP $_{\mathrm {1\,dB}}$ ) of 11 dBm. The RX chip achieves an RF-to-IF CG of 19.5 dB with 9-/14-GHz IF/RF 3-dB bandwidth, a noise figure of 7.7 dB, and an input 1-dB compression point of −28 dBm. The phase-shift characteristics are verified by the TX/RX front-end measurements, achieving a 6-bit phase resolution with minimum rms phase/gain error smaller than 0.83°/0.45 dB and a large phase-shift bandwidth higher than 20 GHz. Preliminary wireless transmission test using a low-cost die-on-printed circuit board (PCB) prototype demonstrates wireless data rates of 1.6 and 0.8 gigabits per second (Gb/s) at distances of 0.4 and 1 m with 256-quadratic-amplitude modulation (QAM) and 16-QAM modulated signals, respectively.
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