W-band Scalable 2×2 Phased-Array Transmitter and Receiver Chipsets in SiGe BiCMOS for High Data-Rate Communication

移相模块 放大器 芯片组 相控阵 电气工程 比克莫斯 发射机 计算机科学 电子工程 工程类 拓扑(电路) 晶体管 天线(收音机) 插入损耗 CMOS芯片 频道(广播) 炸薯条 电压
作者
Huanbo Li,Jixin Chen,Debin Hou,Zekun Li,Rui Zhou,Zhe Chen,Pinpin Yan,Wei Hong
出处
期刊:IEEE Journal of Solid-state Circuits [Institute of Electrical and Electronics Engineers]
卷期号:57 (9): 2685-2701 被引量:21
标识
DOI:10.1109/jssc.2022.3188917
摘要

This article presents a pair of W-band phased-array transmitter (TX) and receiver (RX) chipsets in a 0.13- $\mu \text{m}$ SiGe BiCMOS process for high data-rate wireless communication. Both the chips integrate four compact front-end channels in 2 $\times $ 2 distribution, and the distance between the adjacent RF pads is less than 1.8 mm ( $0.56\lambda $ at 90 GHz) to fit for the tight antenna array and enable array scaling by tiling multiple unit cells. A 6-bit active phase shifter based on the improved phase-inverting variable gain amplifiers is leveraged to achieve high phase-shift precision and bandwidth concurrently. A noise reduction technique using a parallel inductor to resonate with the parasitic capacitors of the cascode transistors is adopted in the low-noise amplifier design. A novel miniature power combiner, which occupies a much more compact area than the Wilkinson power combiner while delivering great RF performance, is proposed and elaborately analyzed. System-level calibration for local oscillator (LO) leakage and dc-offset suppression is enabled by introducing digitally controlled current sources into the up-conversion and down-conversion mixers. On-wafer measurements for the TX chip exhibit a single-channel IF-to-RF conversion gain (CG) of 26 dB, a competitively high output 1-dB compression point (OP $_{\mathrm {1\,dB}}$ ) of 11 dBm. The RX chip achieves an RF-to-IF CG of 19.5 dB with 9-/14-GHz IF/RF 3-dB bandwidth, a noise figure of 7.7 dB, and an input 1-dB compression point of −28 dBm. The phase-shift characteristics are verified by the TX/RX front-end measurements, achieving a 6-bit phase resolution with minimum rms phase/gain error smaller than 0.83°/0.45 dB and a large phase-shift bandwidth higher than 20 GHz. Preliminary wireless transmission test using a low-cost die-on-printed circuit board (PCB) prototype demonstrates wireless data rates of 1.6 and 0.8 gigabits per second (Gb/s) at distances of 0.4 and 1 m with 256-quadratic-amplitude modulation (QAM) and 16-QAM modulated signals, respectively.

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